• Shenzhen, China — August 25, 2025  BMF APAC, a global leader in ultra-high-precision 3D printing, and MultiMatter, an emerging innovator in multi-material photopolymer additive manufacturing, today announced a strategic partnership to co-develop next-generation solutions for multi-material 4D printing. The collaboration will bring together BMF APAC’s micron-level manufacturing capability with MultiMatter’s centrifugal DLP material-switching technology to […]

  • As Moore’s Law slows, the semiconductor industry is increasingly turning to advanced packaging to maintain the trajectory of performance gains. The transition from monolithic scaling to chiplet-based architectures has made heterogeneous integration and high-density interconnects essential. At the heart of this evolution lies an equally critical question: How can we package these complex systems efficiently, […]